PCB products, manufacturing technologies & engineering services
Technical manufacturing support for rigid, flex, rigid-flex, HDI, RF/high-frequency and metal-base printed circuit boards — from CAM and stack-up review through fabrication, assembly, inspection and electrical test.
PCB product range
Board technologies organized by construction and application rather than by marketing category. Each product family can link to its own detailed construction, material and manufacturing limits.
Rigid & Multilayer
FR-4 and specialty laminate constructions from simple double-sided boards through complex multilayer stack-ups.
HDI
Fine geometry builds using laser microvias, sequential lamination and high-density interconnect structures.
Flex & Rigid-Flex
Polyimide flex circuits and combined rigid-flex constructions for static and dynamic bend applications.
RF / High-Frequency
Low-loss laminate systems and hybrid constructions for RF, microwave and high-speed signal designs.
Metal Core / IMS
Aluminium- and copper-base thermal constructions for LED, power conversion and high-heat applications.
Heavy Copper / Power
High-current constructions using increased copper weights and power-oriented conductor geometries.
Rigid PCB manufacturing capability
A buyer should be able to qualify the factory from this section without opening a sales brochure.
| PARAMETER | STANDARD PRODUCTION | ADVANCED / ON REVIEW | ENGINEERING NOTE |
|---|---|---|---|
| Layer count | 1–16 layers* | Up to 32 layers* | Construction dependent |
| Finished thickness | 0.6–2.4 mm* | 0.4–3.2 mm* | Depends on layer count and copper |
| Minimum trace / space | 4 / 4 mil* | 3 / 3 mil* | Outer/inner layer limits may differ |
| Minimum mechanical drill | 0.20 mm* | 0.15 mm* | Aspect ratio applies |
| Finished copper | 1–2 oz* | 0.5–6 oz+* | Fine geometry limited at higher copper |
| Controlled impedance | Supported* | ±7% target* | Stack-up and coupon review required |
| Blind / buried vias | On request* | Supported* | Sequential lamination dependent |
| Via-in-pad | On request* | Filled & capped* | Type VII process where specified* |
| Maximum board size | Engineering review* | Engineering review* | Panel utilization and process dependent |
| Routing tolerance | Per drawing* | Precision routing on review* | Profile type dependent |
* Preview capability values only. Replace with Hextron's qualified production limits before publication.
Technology-specific manufacturing data
Advanced products need their own qualification data. These compact matrices expose the construction details engineers normally need before sending a design.
HDI / Microvia*
Flex / Rigid-Flex*
RF / High-Frequency*
* Technology values remain provisional until matched to Hextron's qualified factory capability matrix.
Laminate & substrate systems
Material selection should be tied to Tg, dielectric performance, thermal requirements, mechanical construction and availability.
Via & hole technologies
Interconnect capability is separated because it frequently determines whether an HDI or dense multilayer design is manufacturable.
Standard mechanically drilled plated holes with aspect-ratio control.
Sequentially laminated interconnect structures for dense multilayer layouts.*
Laser-drilled microvias for HDI structures, subject to dielectric and capture-pad design.*
Conductive/non-conductive fill and planarized/capped structures according to design requirement.*
Surface finishes & special processes
Finish selection affects solderability, planarity, shelf life, contact performance and assembly process compatibility.
| PROCESS | AVAILABLE* | TYPICAL APPLICATION | NOTES |
|---|---|---|---|
| Lead-free HASL | Yes | General-purpose PCB | Economical; less planar than immersion finishes |
| ENIG | Yes | Fine pitch / general assembly | Planar nickel/gold finish |
| ENEPIG | On review | Wire bonding / advanced assembly | Nickel-palladium-gold system |
| OSP | Yes | Fine pitch / cost-sensitive production | Organic copper protection |
| Immersion silver / tin | On review | Application dependent | Storage and handling controls apply |
| Hard gold | On review | Edge contacts / wear surfaces | Selective plating requirements |
| Gold fingers | On review | Card-edge connectors | Bevel and plating thickness per drawing |
| Edge plating | On review | Grounding / RF structures | Profile and copper geometry restrictions apply |
Mechanical processing & finished tolerances
Secondary mechanical processes are often critical qualification points for connector cards, enclosures, RF assemblies and precision hardware.
| FEATURE | CAPABILITY* | DESIGN / PRODUCTION NOTE |
|---|---|---|
| Board thickness tolerance | Per construction / drawing | Confirm for impedance and edge connector applications |
| PTH / NPTH tolerance | Per hole class / drawing | Finished-hole requirement should be specified |
| Routing / profile | CNC routing | Internal radius and dimensional tolerance apply |
| V-score | Supported | Residual web and board thickness restrictions apply |
| Plated slots | Supported | Minimum slot width on review |
| Castellated holes | On review | Edge geometry and plating requirements apply |
| Countersink / counterbore | On review | Drawing must define angle and finished dimensions |
| Gold fingers / bevel | On review | Hard-gold thickness and bevel geometry per drawing |
| Panelization | Routing / V-score / tabs | Optimized for fabrication and assembly flow |
PCBA manufacturing services
Assembly capability should show process coverage, component/package handling, material sourcing and inspection—not simply state “SMT available.”
| PCBA PARAMETER | CAPABILITY* | PROCESS NOTE |
|---|---|---|
| Assembly type | SMT / THT / mixed | Single- and double-sided builds |
| Fine-pitch IC | Engineering review | Pitch, stencil and pad geometry dependent |
| BGA / QFN / CSP | Supported on review | X-ray inspection applied where required |
| Solder paste inspection | SPI* | Process-line dependent |
| AOI | Supported* | Post-placement / post-reflow inspection |
| X-ray | Supported* | Hidden joints / BGA inspection |
| Selective / wave solder | On review* | Through-hole process selection by assembly |
| Functional test | Customer-defined* | Fixture, procedure and acceptance criteria required |
Inspection and verification
Inspection is integrated throughout the manufacturing flow rather than treated only as a final outgoing check.
Automated optical inspection of conductor geometry and manufacturing defects.
Flying-probe or fixture-based continuity/isolation testing according to production requirements.*
Inspection support for BGA and hidden solder joints in assembled products.*
Cross-sectional process verification for plating, hole quality and multilayer registration.*
CAM, DFM & manufacturing engineering
Technical review before production helps resolve manufacturability risks while the design data can still be corrected efficiently.
Artwork, drill, outline, netlist and fabrication data verification.
Fabrication and assembly manufacturability review before release.
Layer construction and material selection against electrical and mechanical requirements.
Trace geometry and dielectric review for controlled-impedance structures.
Quality standards & engineering downloads
Publish only certifications, IPC classes and regulatory claims that can be supported by current factory documentation. The resource area gives engineers useful data without requiring a sales conversation.
Submit your PCB data package
Gerber or ODB++ data · drill files · fabrication drawing · stack-up · IPC requirements · BOM and pick-and-place for assembly.