23 years building boards for medical devices and industrial power. DFM feedback within 24 hours. Layout support from schematic to fabrication data.
Fabrication across five board technologies, plus the layout and sourcing work that gets a design ready to build.
Standard rigid boards for general electronics, from single prototypes to production panels.
Bend-tolerant constructions for enclosures where a rigid board can't fold into place.
Aluminium and copper-base boards for thermally demanding designs.
Fine-geometry and RF-grade builds for dense, high-speed signal layouts.
An engineer takes your schematic through to fabrication-ready output, not just a board vendor waiting for Gerbers.
Parts sourced through franchised distribution, with the paperwork that regulated buyers need on file.
The laminates, finishes, and construction options we build with — check these against your design before you ask us to quote it.
Exploded isometric view of a standard 8-layer build — copper, prepreg, and core shown edge-on. Blind vias L1–L2, buried vias L4–L5, through vias L1–L8.
What happens between your file upload and your board arriving — and how we make sure it comes back right.
24-hour DFM feedback. We flag issues rather than silently modifying your files.
Impedance calculation, panelisation, drill programme.
Registration accuracy ±50 µm, drill tolerance ±0.05 mm.
Automated optical inspection on inner and outer layers.
Flying probe for prototypes, fixture test for volume. 100% e-test standard.
X-ray for BGA and buried structures, impedance coupon test, IPC-A-600 Class 2 visual.
Fabrication, inspection, and component handling — where the boards and the parts around them actually get made and stocked.
Reliability requirements differ by sector. Here's what that means for the board we build you.
Thermal cycling, high-Tg materials, IATF-aligned process control.
Full traceability, complete documentation set, ISO 13485 where applicable.
Metal core, heavy copper, up to 6 oz.
Rogers laminates, controlled impedance, low-loss stackups.
HDI, fine-pitch BGA, cost-optimised stackups.
Boards leave our facility for contract manufacturers, assembly houses, and product teams across five continents. Franchised-distributor sourcing and full CoC documentation travel with every shipment, so customs and compliance are never what holds up your build.
Illustrative figures — swap in real shipment and customer counts.
Four steps from file upload to a board on your bench.
Gerber RS-274X, ODB++, IPC-2581, plus NC drill, IPC-356 netlist, and BOM/CPL for assembly.
24-hour response. We commit to this number and hold it.
Standard lead time 10 days, expedite from 3 days.
Full documentation set included. DHL or FedEx, 2–4 days.
What we've learned building boards other shops decline.
Diagram: impedance stackup cross-section
How dielectric thickness, copper weight, and reference planes interact — and where the tolerance budget actually goes.
Photo: flex board mid-bend showing coverlay
Static versus dynamic bend applications call for different material selection and copper construction from the start.
Macro shot: ENEPIG vs ENIG finish comparison
Wire bonding and mixed assembly change the finish decision — here's the threshold where the upgrade pays for itself.
Or reach us directly at info@hextrontechs.com — 24-hour response, always.